TiN and InSnO reference

InSnO

sample commercial 25 mm fused quartz with ITO, defects and inhomogenieties visible in SEM

also piece of In 99.99% foil Goodfellow, exposed to ambient many months

Lots of C and O plus In.

ALD TiN

Deposited by Aaron and Adam, before 6/12/14, substrate??

See some C, Ti, O, N peak convolved with Ti

Clear difference spectra shape from metallic Ti (PHI Auger book)

Sputter 30 sec 15 mPa using PVi-ko3-Frank settings, modified from Changhyun

After sputter no C, Ar visible, 415:419 peak ratio changes, relative increase 419

previous marks, scan squares, point spots, disappear. 

Cond 80, obj 59.5 2 kV no raster offset (-.2, -.7), specimen current 280 nA.

Only minor changes 2 more 30 sec sputter cycles, total 90s.

Now additional 90 sex

InP reference wafer, n type, AXP, N doped,

New unopened InP wafer from Shaul, American Xtal Tech, n-type
Cleave and mount sample, 3 kV 20 nA 30 tilt, "large hole" holder

C and O contamination, but P and In clear. Take survey CRR 5-10-15-20 and CAE 20

Tried REELS, 5 eV pass, apertures less important, 1400 nominal peak 1392.20 SCM on

InP NW experiments

samples

Dry transfer InP NW onto Si, wires grown by Shaul ~ last year (?)

Auger spectra

No obvious charging, pretty good spectra at 3 nA after careful realign. Max current not good, large spillover onto Si substrate. 

Drift is an issue, works better splitting 50-580 eV spectra, 0.5 eV, 50 ms into two ~ 30 sec parts, otherwise drift off smaller 80-100 nm wide wires.

Mostly In, P, little C, little O, no sign of low energy Au peaks, used 3 kV.

Consider Auger maps, CAE 50, P 121.5 back 140; In 402.5 back 420

Scanning at slow speed shows "glitches", ~ 10 in a speed 11 90 sec frame. Float system, sublimator off, SE2 off, turbo off, no help.

No glitches scan speed 9 and below. In 2048 pixel, however, glitches at speed 9. I think at some scan speed Zeiss syncs to line frequency, this may be related to glitches.....

Auger scale 0.3 LP 6

Labview 2103 August upgrade

• Upgraded PXIe Labview from 2012 f3 to 2013 f2
• Use 2013 DS-2 developer suite distribution, August 2013 release
• 3 DVDs for LV/CVI etc
• 1 DVD device drivers
• 1 DVD additional FPGA/xilink tools
• 2+ hours to run
• share DVD from Matrix-Auger to Auger-pxi
• After upgrade somehow initial daqmx diver install not completed, so projects with analog io were broken
• download and install DAQmx 9.8
• now analog works but cRIO still broken, missing "software or license"
• another hour...
• Download NIRIO130 driver and install
• now cRIO recognized, but software conflict
• use NI MAX remote system/software/Add remove to replace LV 12 environment with LV 13
• now VIs resident on cRIO work, but error from FPGA
• another hour+...
• NI MAX never recognized PXIe 4132 SMU
• needs separate driver, NIDCPWR190
• another GB download and install, almost an hour...
• now SMUs are recognized
• Rebuild FPGA
• go to cRIO/chassis/FPGA target
• rebuild FPGA counter to DAC using existing build spec
• 40 minutes elapsed, no errors
• RT_Omicron.vi still fails, error on FPGA Target RIO0
• Unplug cRIO, try again, now it works, for some reason new bitfiles not downloaded
• communication now OK, Omicron FPGA interface 2.lvproj now works

Now all projects in PXIe Documents/Programs  LV seem to work with 2013. "LV 2012 backups" folder has old versions

SC NbSn wire experiments

Ed build wire cleaving holder, 3 perpendicular wires in clamp.
scribe wire outer diameter by rolling wire on surface with scalpel.
insert wires to scribe mark.
cleave with syringe needle that fits OD

Cleaved in air this time, ~ 1 min exposure before pumpdown.

Wires are Cu clad bundle of 50 um subelements, each should be Cu.96Sn0.04 bronze, with Nb3Sn phase polycyrstalline, ~ 1.5 at. % Ti doped, expect Ti at grain boundaries, also Cu.  intergranular fracture

No problem with Auger, although Ti hard to find. Small Ti 383 peak found but no 418. First peak is L2,3M2,3M2,3, next is L2,3M2,3M4,5 which involves valence levels. See Maline SS 286 p82 1993 for interpretation of Ti Auger.